1) rolling copperplating
滚镀铜
1.
To improve the product quality and production efficiency and reduce the production costs, the pyrophosphate rolling copperplating process has been developed, the impact of the composition of plating liquid and process conditions on the performance of the plating layer has been studied and plating liquid formation and process conditions have been determined.
为提高产品质量和生产效率,降低生产成本,研究开发了焦磷酸盐滚镀铜生产工艺,研究了镀液的组成及工艺条件对镀层性能的影响,确定了镀液配方及工艺务件。
2) coppering plants for gravure forme making
凹印滚筒镀铜设备
3) high-polish coppering
抛光镀铜(凹版滚筒)
4) Barrel plating
滚镀
1.
Decorative gold-imitated barrel plating process for small article of zinc alloy die castings;
锌合金压铸小零件装饰性滚镀仿金工艺
2.
A new Zn-Fe alloy plating process alternative to former cyanide zinc plating was adopted for barrel plating auto lines of motor components and parts in the factory of Chang'an group Co.
某厂汽车零部件滚镀自动线采用锌铁合金新工艺取代了原氰化滚镀锌工艺。
5) copper plating
镀铜
1.
Neutral non-cyanide copper plating on steel;
钢铁基体上中性无氰镀铜
2.
Roughening process of wrought rolled copper foil used for PCB by copper plating method;
印制板用压延铜箔镀铜粗化工艺
3.
Analytical determination and adjustment of chloride ion in acid copper plating bath;
酸性镀铜镀液中氯离子的分析测定及调整方法
6) copper-plating
镀铜
1.
The copperplating process of graphite powder was investigated and the optimum process parameters were obtained by comparing the copper-plating results.
对石墨粉末的化学镀、电镀及复合镀等镀铜方法进行比较,优化出石墨粉末镀铜的最优方法,并在镀铜工艺上进行了研究,实验表明,通过采用改善石墨粉末分散性的活化剂及优化纯化剂,可提高镀铜层的厚度、连续性及镀层的耐蚀性。
2.
his paper instroduces an anticarbonized copper-plating process with highcurrent efficience and high ductility.
本文介绍了一种高效率、高韧性、防渗碳镀铜工艺，可以大辐度提高铜镀层的沉积速度，降低铜层孔隙率，提高产品合格率，具有显著的经济效益和社会效益。
补充资料：滚镀
分子式：
CAS号：
性质：大批小零件放在滚动的容器中进行电镀的过程。如钢铁零件滚镀锌、滚镀铜、滚镀高锡青铜；铜和铜合金零件滚镀镍等。滚镀溶液和电镀条件与槽镀基本相同，有时根据材质和镀件形状也会作一些调整。
CAS号：
性质：大批小零件放在滚动的容器中进行电镀的过程。如钢铁零件滚镀锌、滚镀铜、滚镀高锡青铜；铜和铜合金零件滚镀镍等。滚镀溶液和电镀条件与槽镀基本相同，有时根据材质和镀件形状也会作一些调整。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条