1) spot plating
点镀
2) gold plated contacts
镀金触点
1.
The contamination on contact surfaces was found to be one of the main reasons to cause electric contact failure by analyzing lots of gold plated contacts in failed mobile phones.
研究了大量失效手机中的镀金触点后发现,触点表面污染是造成电接触故障的主要原因之一。
3) electroplating bump
电镀凸点
1.
The process flow of electroplating bump and the issues of UBM wet etching were discussed.
介绍了电镀凸点封装工艺流程和其中有关金属层湿化学刻蚀的问题。
4) bump plating
凸点电镀
1.
The noise mechanism and the effective measures to reduce noise were analyzed,and special preparation technology of low-noise Zener diode was explored including additional guard-ring structure,the chlorine-doped oxidation with temperature rising and falling slowly,CVD surface passivation,bump plating and so on.
分析了二极管的噪声机理和降低噪声的措施,探索了低噪声齐纳二极管的特殊制作工艺,包括Si平面结加保护环、掺氯缓慢升降温氧化、CVD表面钝化、凸点电镀等。
5) A Bit of Experience on Electroplating
电镀经验点滴
6) plating
[英]['pleɪtɪŋ] [美]['pletɪŋ]
镀
1.
The deposition parameters, structures and element distribution of electroless Ni-Mo-P deposits, which were obtained from plating baths containing tartrate-lactic acid as complexing agent, were studied.
对自酒石酸盐-乳酸为络合剂体系的镀液中制得的Ni-Mo-P合金镀层的参数、结构及元素分布进行了研究。
2.
In view of the traditional making technology of smooth limit gauge,a method of plating surface is put forward.
针对光滑极限量规传统的制造工艺,提出了表面镀层的方法,分析了工艺过程,通过 试制,达到了一定的效果。
补充资料：闭式单点、双点压力机
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主要参数内容 | 国际先进 | 国内先进 | 国内一般 | 国内落后 | 评定方法及说明 | ||
（一）加工精度 | 参照GB10924-89、GB10933-89、JB5200-91 | ||||||
1、滑块下平面对工作台上平面的平行度（mm） | 30%精度储备 | 20%精度储备 | 达到规定值 | 大于规定值 | |||
0.02+0.10/100×滑块下平面的被测长度 | |||||||
2、滑块行程对工作台上平面的垂直度 | 30%精度储备 | 20%精度储备 | 达到规定值 | 大于规定值 | |||
0.05+0.02/100×滑块行程长度 | |||||||
（二）结构性能 | |||||||
1、离合器、制动器接通率，当滑块行程次数≤16次/分时为70%，≤25次/分时为60%，≤45次/分时为50% | 大于规定值10% | 大于规定值 | 达到规定值 | 达不到规定值 | |||
2、液压超负荷保险装置、微调装置、吨位指示器 | 全部具有 | 全部具有 | 部分具有 | 没有 | |||
（三）噪声dB（A） | |||||||
1、公称力≤400kN | ≤85 | ≤87 | ≤88 | ＞88 | |||
2、公称力＞400kN | ≤87 | ≤88 | ≤90 | ＞90 | |||
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条