1) isothermal cure
等温固化
1.
It was found that the increase of E′ during isothermal cure process at high temperatures is different from the one at low temperatures.
采用动态力学分析法(DMA)对648环氧预浸料的等温固化过程进行了表征分析。
3) isothermal solidification
等温凝固
1.
Dynamic simulation of isothermal solidification in steel/Cu/steel system rolling-diffusion bonding process;
碳钢/Cu/碳钢系统轧制——扩散复合等温凝固过程的动力学模拟计算
2.
Simulation of isothermal solidification of ternary alloy with phase-field model;
三元合金等温凝固过程的相场法模拟
3.
Phase-field simulation of isothermal solidification of binary alloy based on KKS model;
基于KKS模型二元合金等温凝固过程的相场法模拟
4) semi-solid isothermal heat-treatment process
等温半固态
5) non-isothermal solidification
非等温凝固
1.
Phase-field simulation of influence of anisotropy on process of non-isothermal solidification;
各向异性影响非等温凝固过程的相场法模拟
2.
Phase-field Simulation of Non-isothermal Solidification of Binary Alloy;
二元合金非等温凝固过程的相场法模拟
3.
Phase-field simulation of non-isothermal solidification dendrite growth of binary alloy under the force flow
强迫对流影响二元合金非等温凝固枝晶生长的相场法模拟
补充资料：35CrNi3MoV钢等温淬火组织
35CrNi3MoV钢等温淬火组织
35CrNi3MoV钢等温淬火组织马氏体(绿)+见氏体(棕)残余奥氏体(浅黄)
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条