1.
Dynamic mechanical analysis of isothermal curing of epoxy prepreg
用DMA研究环氧预浸料的等温固化过程
2.
Non-isothermal cure kinetics of V-POSS/UPR and physical properties
V-POSS/UPR非等温固化动力学与物理性能
3.
On the Mixed-Boundary Value Problem in the Equilibrium State of the Model for the Isothermal Solidification Process of a Binary Alloy;
一类二元合金等温固化模型平衡态的混合边值问题
4.
Study on non-isothermal curing kinetics of unsaturated polyester resin with complex initiation system
不饱和聚酯/复合引发体系非等温固化动力学研究
5.
Grain Refinment of AM60B+XCa Magnesium Alloys and Microstructure Evolution during Semi-solid Isothermal Treatment
AM60B+XCa的细化及在半固态等温处理中组织的演化
6.
The time-temperature equivalence of the adhesive is confirmed.
同时胶粘剂的固化时间和温度存在等效性关系。
7.
Isothermal Crystallization Kinetics of Dynamically Cured PP/MAH-g-PP/Epoxy Blends
动态固化PP/MAH-g-PP/EP共混物的等温结晶动力学
8.
Curing Kinetics of HTPB/TDI/Al System by Non-isothermal DSC
非等温DSC研究Al/HTPB/TDI体系的固化反应动力学
9.
Curing Kinetics of Bisphenol-A Epoxy Resin with Polyamide by Isothermal Differential Scanning Calorimetry
等温DSC法研究聚酰胺与环氧树脂的固化动力学
10.
Preparation and Characterization of Solid Electrolyte and Other Materials Used in Intermediate Temperature Solid Oxide Fuel Cell;
中温固体氧化物燃料电池用电解质等材料的制备及性能研究
11.
Microstructure Evolution of Ti14 Alloy during Isothermal Process
Ti14合金半固态等温热处理过程中的组织演化规律
12.
Nonisothermal Cure Kinetics of a High Toughness and Low Volume Shrinkage Ratio Epoxy System
非等温DSC法研究高韧性低收缩环氧体系固化动力学
13.
e package RTV silicon rubber
单包装保温固化硅橡胶
14.
Effects of temperature and holding time on the semi-solid isothermal heat-treated microstructure of ZL104 aluminum alloy
等温温度和时间对ZL104铝合金半固态等温热处理组织的影响
15.
Molecular dynamics simulation of liquid Cu during isothermal solidification
液态Cu等温凝固的分子动力学模拟
16.
Synthesis and Thermochemical and Non-isothermal Thermal Decomposition Kinetic Studies on Gd(Ala)_3(Gly)2Cl_3·2H_2O (s);
氯化钆与L-丙氨酸和甘氨酸三元固态配合物的合成及热化学和非等温热分解动力学研究
17.
isothernal transformation case hardening
等温转变表面硬化处理
18.
Study on curing reaction kinetics of low temperature curable BMI modified by PES
PES改性低温固化双马树脂固化动力学研究