1) silver contact materials
银基触头
1.
The combined properties of the material, such as density, hardness, resistivity, arc resistance and temperature characteristics, are similar to those of conventional silver contact materials.
该材料的综合性能,如密度、硬度、电阻率、灭弧特性及温度特性与传统的银基触头材料接近。
2) Silver-based contact materials
银基触头材料
1.
Based on arc and electrical contact theory, the expemiments of erosion characteristics of silver-based contact materials commonly used in switching apparatus have been performed, some useful conclusions have been put forward according to the experimental results and microanalysis by SEM.
根据电接触与电弧理沦,对开关电器常用的银基触头材料的电弧侵蚀现象做了试验研究,通过对试验后触头表面的微观分析得出了一些有参考意义的结论。
3) Silver based
银基
4) silver matrix brush
银基电刷
1.
Study on friction wear properties of silver matrix brush material;
银基电刷材料的摩擦磨损性能研究
5) silver paste
银基浆料
1.
The authors of the present article developed a low-temperature sintered silver paste which added the glass frit as binder phase and was applied to the integrated circuits semiconductor chip technology.
研制了一种以玻璃粉作为粘结相的低温烧结型银基浆料,并应用于集成电路半导体芯片贴装工艺。
6) Ag-based filler metal
银基钎料
1.
The mechanism of interaction between rare earth element Ce and Pb or Bi in Ag-based filler metal was studied.
研究了银基钎料中铈与铅、铋的作用机制 ,发现在银基钎料中铈与铅、铋易形成高熔点的CePb ,CeBi化合物 ,从而抑制了铅单质相和铋单质相的形成 ,消除了杂质元素铅、铋对银基钎料铺展性能的有害作用。
参考词条
银基催化剂
银基复合材料
银基汞膜微电极
银基复合镀层
银基汞膜电极
Bi系银基带材
银基触点材料
银基电触头材料
氰化银基配合物
银基电接触材料
铜(银)基复合材料
镀铜石墨-银基复合材料
履带机械
CYP2C9酶系
补充资料:金头银面
1.谓用首饰﹑脂粉打扮头面。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。