2) transient liquide phase bonding process
瞬间液相焊
3) Transient Liquid Phase (TLP)
瞬间液相(TLP)
4) transient liquid phase bonding
瞬间液相连接
1.
T91 steel pipe was joined by transient liquid phase bonding under low pressure at 1 230-1 260 ℃,and the influence of bonding temperature on the microstructure and composition of the joints was investigated by EPMA.
在1 230~1 260℃温度范围内进行了T91钢管的加压瞬间液相连接,利用电子探针研究了焊接温度对接头组织、成分的影响。
5) transient liquid phase diffusion bonding
瞬间液相扩散焊
1.
Contact-melting and isothermal solidification are two important stages in transient liquid phase diffusion bonding process, which are the key factors that affect the properties of the joint and become the hot topic in the research field.
接触熔化与等温凝固是瞬间液相扩散焊过程中两个非常重要的阶段,是获得优质连接接头的关键,一直以来也是学术界研究的热点。
2.
TiNi shape memory alloy and stainless steel were bonded by transient liquid phase diffusion bonding(TLP-DB)with AgCu metal foil as the interlayer.
采用AgCu金属箔作中间层,对TiNi形状记忆合金与不锈钢进行了瞬间液相扩散焊。
6) transient liquid phase diffusion bonding(TLPDB)
瞬间液相扩散复合
补充资料：高温瞬间杀菌器
高温瞬间杀菌器   | |
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条