1) PTLP bonding
部分液相瞬间连接
2) double partial transient liquid phase bonding
二次部分瞬间液相连接
1.
Bonding strength of double partial transient liquid phase bonding with Si_3N_4/Ti/Cu/Ni/ Cu/ Ti/ Si_3N_4;
Si_3N_4/Ti/Cu/Ni/Cu/Ti/Si_3N_4二次部分瞬间液相连接强度
4) transient liquid phase bonding
瞬间液相连接
1.
T91 steel pipe was joined by transient liquid phase bonding under low pressure at 1 230-1 260 ℃,and the influence of bonding temperature on the microstructure and composition of the joints was investigated by EPMA.
在1 230~1 260℃温度范围内进行了T91钢管的加压瞬间液相连接,利用电子探针研究了焊接温度对接头组织、成分的影响。
5) transient liquid phase diffusion bonding
瞬间液相扩散连接
1.
The method of transient liquid phase diffusion bonding(TLP-DB) was widely applied in the advanced materials bonding fields because of its unique characteristic advantage.
瞬间液相扩散连接(TLP-DB)方法以其独有的性能优势,在先进材料连接领域得到广泛的重视和应用。
补充资料：高温瞬间杀菌器
高温瞬间杀菌器   | |
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条