1)  silicon chip
硅基片
1.
6% Cu alloy thin film was prepared on silicon chip with mosaic target by DC magnetron sputtering under non-heating condition.
采用镶嵌靶、通过直流磁控溅射法在不加热的情况下于硅基片上制备了Ti-49。
2)  single crystal silicon substrate
单晶硅基片
3)  Silicon substrate
硅基
1.
The light intensity distribution and development processes during the preparation of two-dimensional patterned silicon substrates by holographic lithography are simulated.
理论上模拟了全息光刻法制备二维硅基图形阵列的光强分布和显影过程,通过改变激光波长及入射光与样品表面的夹角即可得到不同周期的二维图形。
4)  silicon-based
硅基
1.
Research progress of nanoarrays prepared by silicon-based AAO template method;
硅基AAO模板法制备纳米阵列研究进展
5)  Si substrate
硅基
1.
55μm InP-InGaAsP quantum-well lasers are fabricated on Si substrates by wafer bonding.
在硅基上成功地制备出了1。
6)  Si-substrate
硅基
1.
Study on Si-substrate/polyimide humidity sensing device;
硅基/聚酰亚胺湿度敏感元件研究
参考词条
补充资料：9-三甲硅基-6-[(三甲硅基)氧]基-9H-嘌呤
CAS: 17962-89-9
分子式: C11H20N4OSi2

中文名称: 9-三甲硅基-6-[(三甲硅基)氧]基-9H-嘌呤

英文名称: 9-(trimethylsilyl)-6-[(trimethylsilyl)oxy]-9H-Purine
O6,9-bis(Trimethylsilyl) hypoxanthine
9-(trimethylsilyl)-6-[(trimethylsilyl)oxy]-9h-purin
说明：补充资料仅用于学习参考，请勿用于其它任何用途。