1)  intermetallic compound
铜锡化合物
2)  Cu-Sn alloy
铜锡合金
1.
Electroplated Cu-Sn alloy coating is good in decoration and solderability,low in cost,non-toxic,not irritable,etc.
电镀铜锡合金具有装饰性好、可焊性优良、成本低、无毒、不使人体过敏等优点,而得到广泛的应用。
2.
The method use SCR continuous casting-rolling system to make conducting wire(Cu-Sn alloy rod) for railway application was introduced.
介绍了采用SCR连铸连轧生产线生产高速电气化铁路接触网线用铜锡合金线坯的方法,用该法生产的产品,具有内部组织细小,均匀的晶粒,强度高,软化温度高,平直度好,耐摩性好,抗蠕变性好等特点。
3.
The paper describes the process ofφ20mm Cu-Sn alloy wirebar production in continuous casting and roiling process,analyzes the impact of the wirebar s oxygen and tin content distribution on production stability, describes the cold-forming process of contact wire manufacturing by drawing machine,and studies and compares anti-drawing strength and extension capability of it.
介绍了采用连铸连轧工艺生产φ20mm铜锡合金线坯的过程,分析了线坯氧含量、锡含量对生产稳定性的影响。
3)  separation of Cu-Sn
铜锡分离
4)  copper tine deposit
铜锡矿
1.
NuoHeiQian copper tine deposit is mostly produced in tourmaline-quartz vein.
喏嘿欠铜锡矿主要产于电气石石英脉中,矿物组合以亲硫矿物和次生氧化矿物为特征。
5)  copper-tin soldering
铜锡焊接
6)  Copper-Tin alloy
铜锡合金
1.
Electrochemical behaviors of Copper, Tin and Copper-Tin in electrodepositingCopper-Tin alloy from noncyanide bath have been studied using cyclic voltammetry.
运用循环伏安法，研究了无氰电沉积铜锡合金溶液中Ｃｕ、Ｓｎ的单独电沉积及其它们共电沉积的电化学行为。
2.
A new process of electrodepositing of bright Copper-Tin alloy from noncyanide bath is proposed in this paper.
提出了一种无氰电沉积光亮铜锡合金的新工艺。
参考词条
补充资料：铜化合物


铜化合物
Copper Compounds

化工百科全书第16卷化学工业出版社铜化合物tongtonghuahewu铜化合物Copper Compounds朱屯中国科学院化工冶金研究所1.2.2 .1.2 .1.1.2.1.2.2 .1.3.2 .1.4.2 .2.2 .3.2 .4.2 .5.3.3 .1.3.1.1.3 .1.2.3.1.33 .2.3 .2.13 .2.2.3。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。