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1)  lead frame
引线框
1.
The punching process of the lead frame was analyzed, the multi-position progressive die was designed.
分析了引线框的冲压工艺性,设计出了多工位级进模。
2.
The lead frame structures of LET(light emitting triode)are much fine and with high yields,it is for high speed punch with very high precision and life.
发光三极管的引线框结构较为精细,产量很大,用高速冲床生产,对模具的精度和寿命要求很高。
2)  lead frame
引导框,引线框
3)  lead frame
引线框架
1.
Study on heat treatment process of C194 copper alloy for lead frame;
引线框架用铜合金C194热处理工艺研究
2.
Development of Cu-Ni-Si alloy for lead frame;
引线框架用Cu-Ni-Si合金的发展
3.
Microstructure and properties of Cu-Ni-Si based alloys for lead frame;
Cu-Ni-Si基引线框架合金的组织和性能
4)  Leadframe
引线框架
1.
When the leadframe made of 4J42 alloy is brazed to the brazing zone of an alumina substrate using an AgCu28 filler in ceramic DIP production, the liquid filler often flows onto the surface of the leadframe after brazing, and the quality of finished products is influenced greatly.
陶瓷DIP外壳需要使用AgCu28钎料将4J42合金引线框架与陶瓷基板的焊区钎焊在一起,焊后易出现钎料在引线框架上流淌的问题,影响产品的质量。
2.
Inthispaper,themicrostructuresandtheirchangesinhightemperatureoftheinterfacesbetweenfourcivilcopperalloysforleadframeandSn -Pbsolderalloysarestudied .
研究了四种国产引线框架用铜合金与Sn -Pb共晶焊料的界面结构及其在高温保温过程中的变化。
3.
It was discussed the leadframe driving structure moving along line intermittently, especially the principle of the 3D cam in the designed die bonder.
讨论了IC芯片粘片机的引线框架直线间歇式供送机构和空间凸轮的工作原理。
5)  lead-frame
引线框架
1.
Effect of Rare Earth on Oxidation Performance of Cu Alloys for Lead-frame;
稀土对引线框架用铜合金氧化性能的影响
2.
The simulation results show that parameters such as material,shape and the thickness of the lead-frame have immediate effects on the thermal performance.
介绍了AutoTherm软件热分析流程,通过仿真分析了集成电路封装中引线框架的形状、厚度、材料等参数对集成电路热性能的影响,提出了设计具有良好导热性能引线框架的条件,即尽量选用导热系数大的合金材料做引线框架。
6)  lead frame pin
引线框脚
补充资料:无针难引线
1.比喻没有撮合者成不了事。
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