1) Cu-W thin film
Cu-W薄膜
1.
The surface morphology evolution and phase structures of Cu-W thin films with annealing temperatures were investigated.
提出了一种基于离散小波变换和分形几何概念定量描述薄膜表面形貌各向异性的新方法,并据此研究了磁控溅射Cu-W薄膜表面结构特征随退火温度的演变。
2) Cu-W thin films
Cu-W薄膜
1.
The evolution of surface morphology of Cu-W thin films with deposition time on silicon wafers was studied by discrete wavelet transform (DWT).
Cu-W薄膜在溅射时间超过600 s时才达到稳定。
3) TiO_ 2-W thin films
TiO_2-W薄膜
4) W/ TiO2 thin film
W/TiO2薄膜
5) copper thin film
Cu薄膜
1.
An in situ method for characterizing the kinetics of the oxidation process of copper thin films via sheet resistance;
方块电阻法原位表征Cu薄膜氧化反应动力学规律
6) Ag/Cu thin film
Ag/Cu薄膜
1.
Simulation of annealing stress in Ag/Cu thin films;
对Ag/Cu薄膜退火应力的模拟
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条