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1)  via-filling
填孔
1.
Development status of via-filling technique was summarized,and the parameters applied to the via-filling,which includes the current density,the mode of agitation and waveform of current were also discussed.
综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理。
2)  through hole filling
通孔填孔
1.
The paper describes that achieves through hole filling by accelerator-free formulas in DC plating.
文章介绍了采用不含加速剂的直流电镀方案来实现通孔填孔技术,并提出通孔填孔的可能电化学机理。
3)  via fill plating
导通孔填孔
4)  micropore filling
微孔填充
1.
The adsorption capability of activated carbon C40/4 for some organic gases,such as acetone,toluene and methylene dichloride,was studied using micropore filling theory.
用微孔填充理论研究了活性炭C40/4对丙酮、甲苯、二氯甲烷有机气体的吸附性能,测试了该活性炭对3种有机气体在不同温度下(288。
5)  pore filling
孔隙填充
1.
For the hardening process of the stabilized soil,a new structural model of stabilized soil was proposed that the structure formation of stabilized soil included soil particle cementing and pore filling.
另外,通过用膨胀剂代替上述固化剂中用于填充孔隙的水泥掺量,以及减少和增加固化剂中水泥掺量,验证了土颗粒胶结和孔隙填充对固化土结构形成及强度增长的作用,并指出孔隙填充对固化土抗压强度提高起重要作用。
6)  porous media
多孔填料
1.
The methods for quantifying evaluation indices of porous media's surface physical properties are studied, and the quantificational expressions of surface roughness, available micropore volume and mean pore diameter are supplied in the article.
本文对多孔填料表面物理特性评价指标的定量化方法进行了研究,推导了表面粗糙度、微孔有效孔客、均值孔径等的定量表达式,并对比分析了三种多孔填料的表面物理特性,指出生物催化填料的表面物理特性最佳。
2.
Fractal and fractal dimensions are introduced into the research on the surface character and micropore structure of porous media used in water and wastewater treatment.
将分形和分数维概念用于水处理多孔填料表面特征和微孔结构的研究,并通过对酶促生物填料测试数据的分析证明:多孔填料的表面和微孔结构具有典型的分形特征,其面积分数维越大,填料表面越粗糙;其容积分数维越大,微孔占有空间的能力越强。
补充资料:水性填孔料
水性填孔料  木家具油漆打底常用的一种填孔料,即“水老粉”。山碳酸钙(老粉)与水配比。用于粗木孔的为1:1;细木孔的为0.4:0.6,然后根据色泽要求加适量的着色颜料。 
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