1) light induced hole erasing
光致填孔
1.
To resolve all these problems, the most important point is light induced hole erasing.
问题的关键在于光致填孔机制的研究。
2) hole forming filler
致孔填充剂
1.
Study work focuses on the effect of the contents of epoxy resin,phenol resin and hole forming filler on the grinding function of fine grinder and polishing grinder.
利用酚醛树脂作为结合剂、环氧树脂作为改良剂制备异型石材磨具，研究环氧树脂、酚醛树脂和致孔填充剂含量对细磨磨具的磨削性能和抛光磨具的抛光性能的影响。
3) via-filling
填孔
1.
Development status of via-filling technique was summarized,and the parameters applied to the via-filling,which includes the current density,the mode of agitation and waveform of current were also discussed.
综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理。
4) through hole filling
通孔填孔
1.
The paper describes that achieves through hole filling by accelerator-free formulas in DC plating.
文章介绍了采用不含加速剂的直流电镀方案来实现通孔填孔技术,并提出通孔填孔的可能电化学机理。
5) tight pack
致密充填
6) via fill plating
导通孔填孔
补充资料：光致致
1.有光泽而细腻貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条