1) filled hole pacte
填孔胶
2) beaumlntage,beaumontage
填孔料(填木孔用的树脂胶泥)
3) via-filling
填孔
1.
Development status of via-filling technique was summarized,and the parameters applied to the via-filling,which includes the current density,the mode of agitation and waveform of current were also discussed.
综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理。
4) through hole filling
通孔填孔
1.
The paper describes that achieves through hole filling by accelerator-free formulas in DC plating.
文章介绍了采用不含加速剂的直流电镀方案来实现通孔填孔技术,并提出通孔填孔的可能电化学机理。
5) via fill plating
导通孔填孔
6) micropore filling
微孔填充
1.
The adsorption capability of activated carbon C40/4 for some organic gases,such as acetone,toluene and methylene dichloride,was studied using micropore filling theory.
用微孔填充理论研究了活性炭C40/4对丙酮、甲苯、二氯甲烷有机气体的吸附性能,测试了该活性炭对3种有机气体在不同温度下(288。
补充资料：孔胶
1.很扎实﹑牢固。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条