This paper investigated the influence of abrasive size,load and spindle speed in grinding process on surface/subsurface damage of Nd-doped phosphate glass experimentally.

A molecular dynamics(MD) simulation is carried out to analyze the effect of cutting edge radius,cut-depth,and grinding speed on the depth of subsurface damage layers in monocrystal silicon grinding processes on an atomic scale.

For the subsurface damage layer of optical materials in grinding process, a combined method of MRF spot technique and HF acid differential chemical etch rate method was proposed to measure the depth of subsurface crack layer and thickness of residual stress layer.

The control method of surface/subsurface damage in advanced ceramics grinding was presented.

After polishing,the sub surface damage of wafer is measured by TEM.

Prediction of surface damage for Al_2O_(3s)f/2A12 composites by liquid infiltration-extrusion process

It is pointed out by the brittle fracture appearance observation of 80 steel wire rod and microstructure analysis that the plastic distortion of basal metal and dislocation adding at surface damage position are the main cause of wire drawing breaking.

Surface damages of Te solvent and Bridgman grown HgCdTe wafers have beenstudied with X-ray reflection topography.

Application of fractal for damage surface of concrete;