The influence of the parameters during the polishing process such as the types of polishing powder, the polishing speed, the characters of the polishing glass, on the properties of the polished components has been studied, and the detailed analysis has been made based on the polishing theory.

The study indicates that the thickness of slurry layer increases with increasing polishing speed and the increasing trend decreases with increasing polishing rotational speed.

The different polish rate for different polish material cause dishing.

The influence of the pressure,polishing temperature,oxidant concentration and slurry flow rate on polishing rate was discussed.

The mechanism of W-CMP was analyzed,the slurry makes a dual function of chemical erosion and mechanical lapping,has an important influence on the polishing rate.

To reduce the roughness and keep agreeable polishing rate,different polishing processes were needed,the hardness of polishing pad and the particle diameter of silicon dioxide in slurry should be reduced gradually,and the pH of slurry should be kept at appropriate range.

A few factors that affect dispensing velocity are analysed.