1.
Research on Electroplating Techonology and Mechanism of Sn-Ag-Cu Alloy Coatings;
电沉积Sn-Ag-Cu合金工艺及沉积机理研究
2.
Wettability of Sn-Zn,Sn-Ag-Cu and Sn-Bi-Cu Lead-free Solder Alloys with Copper Substrate
Sn-Zn,Sn-Ag-Cu和Sn-Bi-Cu无铅焊锡合金与铜的润湿性
3.
Study on Production of Free-Lead Solder Alloy and Solder Alloy Fine Powder of Sn-Ag-Cu System;
Sn-Ag-Cu系无铅焊锡合金及其微粉制备技术研究
4.
Research on Properties of Sn-Ag-Cu Solder Alloy Doped with Sb;
掺杂Sb的Sn-Ag-Cu系焊料合金性能的研究
5.
Aging Characteristics of Pd-Ag-Sn-In-Zn Alloy
Pd-Ag-Sn-In-Zn合金时效特性
6.
Microstructure and Solderability of Sn-Ag-Cu Lead-free Solder Powder and Alloy
Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比
7.
Ag-Cu-Sn Compound Electronic Support Material
Ag-Cu-Sn复合电子支架功能材料
8.
Active Brazing AlN Ceramic and Mo-Cu Alloy Using Ag-Cu-Ti
Ag-Cu-Ti活性法封接AlN陶瓷与Mo-Cu合金
9.
The Experiment and Theoretics Study of Viscosity of Cu-Sn Alloys;
Cu-Sn合金熔体粘度的实验与理论研究
10.
Research on the Directionally Solidified Microstructure of Cu-Sn Peritectic Alloys;
Cu-Sn包晶合金定向凝固组织研究
11.
Study on rapid solidification welding techniques of quenched Cu-Sn alloy foils
急冷Cu-Sn合金箔快速凝固连接工艺
12.
Process for Electroplating of Pb-Sn-Cu Ternary Alloy Coating
Pb-Sn-Cu合金共沉积工艺研究
13.
Investigation on Oxidation Mechanism of Ag-Sn Alloy and High Temperature Plastic Deformation Behaviour of Ag-SnO_2 Materials
Ag-Sn合金氧化机理与Ag-SnO_2材料的高温塑性变形行为研究
14.
Separation and Controlling of Intermetallic Compounds in Lead-free Sn-Ag Solders;
Sn-Ag系无铅焊料中金属间化合物的形成与控制
15.
Rapid Solidification of Ag-Cu-Sb Ternary Eutectic Alloy;
Ag-Cu-Sb三元共晶合金的快速凝固研究
16.
Study on Cu-Ag-Si-Ga Series Brazing Filler Alloys with Low Vapour Pressure
Cu-Ag-Si-Ga系低蒸气压钎料合金研究
17.
A Study on the Active Brazing of AlN to W-Cu Alloy with Ag-Ti_4 Active Filler Alloy
Ag-Ti_4活性钎料钎焊AlN与W-Cu合金研究
18.
Effects of Ag on Microstructure and Properties of Al-Cu-Mg Alloy
Ag对Al-Cu-Mg合金组织与性能的影响