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1)  single crystal silicon
单晶硅
1.
Study of Parameters of Neutron-Irradiated Single Crystal Silicon;
中子辐照的单晶硅参数研究
2.
Study on Partial Cone Cracks in Nano-grinding of Single Crystal Silicon;
单晶硅纳米磨削过程的摩擦裂纹试验研究
3.
Study on establishing and testing for ultra-precision machining single crystal silicon surface roughness of prediction model
单晶硅超精密切削加工表面粗糙度预测模型的建立及试验研究
2)  monocrystalline silicon
单晶硅
1.
Determination of Trace Germanium in Monocrystalline Silicon by ICP-AES;
等离子体发射光谱法测定单晶硅中微量锗
2.
Comparison of specific yield of solar cell assemblies madefrom amorphous silicon and monocrystalline silicon;
非、单晶硅太阳能电池组件比功率发电量比较
3.
The measurement temperature of monocrystalline silicon with Raman spectrum;
单晶硅片温度的拉曼光谱测定
3)  single-crystal silicon
单晶硅
1.
The micro-tribological and nano-mechanic properties of Ar~+ implanted single-crystal silicon were investigated by using a Micro-tribology Text and a Nano Indenter System, The results show that Ar~+ implantation of single-crystal silicon had increased the wear-resistance, the best dose is 1×10~(16) ions /cm~2.
利用离子注入技术对单晶硅表面进行了氩离子注入,用微摩擦磨损实验机研究了改性层的摩擦磨损行为,并用透射电子显微镜研究了改性层的微观结构。
2.
In Chemical-Mechanical polishing experiments we produced optical quality super smooth surfaces on single-crystal silicon, but cannot insure the surface figure.
使用机械 -化学抛光法加工大尺寸单晶硅可获超光滑表面 ,但很难保证良好的面型。
3.
The nano-scratch behaviors of Ar+ implanted single-crystal silicon were investigated by a nano indenter system, the micro-structure of the implanted layer was analyzed with TEM.
通过离子注入技术对单晶硅表面进行氩离子注入处理,利用纳米压痕仪及其附件研究了单晶硅表面在离子注入前,后的微观力学性能和变形机理,并用透射电子显微镜研究了改性层的微观结构。
4)  monocrystal silicon
单晶硅
1.
Molecular dynamics simulation in monocrystal silicon indentation;
单晶硅纳米级压痕过程分子动力学仿真
2.
A molecular dynamics(MD) simulation is carried out to analyze the effect of cutting edge radius,cut-depth,and grinding speed on the depth of subsurface damage layers in monocrystal silicon grinding processes on an atomic scale.
应用分子动力学仿真研究了原子量级条件下磨粒钝圆半径、磨削深度和磨削速度对单晶硅磨削后亚表面损伤层深度的影响。
3.
The authors carry out respective researches on the making of electrode,installation of experiment,choice of electrolyte for electrolysis hydrogenadulterated of p-type monocrystal silicon,and the distribution of shallow impurity consentyation of p-type moncrystal silicon of electyolysed.
分别对 P 型单晶硅电解掺氢的电极制作、实验装置、电解液的选择、电解后浅杂质浓度的分布等进行了研究。
5)  Silicon [英]['sɪlɪkən]  [美]['sɪlɪkən]
单晶硅
1.
Experimental Research on Cutting of Silicon and Ceramic with Fixed Diamond Endless Wire Saw;
环形固结金刚石线锯切割单晶硅与陶瓷的实验研究
2.
Study on the AFM-based micro-machined silicon surface;
基于AFM微加工的单晶硅表层性质的研究
3.
Research on Wet Anisotropic Etching of Silicon in MEMS;
MEMS中单晶硅的湿法异向腐蚀特性的研究
6)  seed of single crystal silicon
单晶硅籽晶
补充资料:单晶硅
      单质硅的一种形态。熔融的单质硅在凝固时硅原子以金刚石晶格排列成许多晶核,如果这些晶核长成晶面取向相同的晶粒,则这些晶粒平行结合起来便结晶成单晶硅(见彩图)。
  
  
  单晶硅具有准金属的物理性质,有较弱的导电性,其电导率随温度的升高而增加;有显著的半导电性。超纯的单晶硅是本征半导体。在超纯单晶硅中掺入微量的ⅢA族元素,如硼可提高其导电的程度,而形成p型硅半导体;如掺入微量的ⅤA族元素,如磷或砷也可提高导电程度,形成n型硅半导体。
  
  单晶硅的制法通常是先制得多晶硅或无定形硅,然后用直拉法或悬浮区熔法从熔体中生长出棒状单晶硅。单晶硅主要用于制作半导体元件。
  

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