ICF靶丸:ICF target
ITmk3:ITmk3
ITO靶材:ITO target
IPN涂料:IPN paint
I-EDI:I-EDI
IR光谱法:IR spectrum method
ISO转鼓:ISO drum
ISO代码:ISO Code
ICA技术:ICA technology
IVE模型:IVE model
In-Sn:In-Sn
I/O模板:I/O formwork
IPN技术:IPN technology
IDEF0:IDEF0
IDD估计:IDD estimate
InCl3:InCl_3
ISM方法:ISM method
ICGH5:ICGH5
I2C总线:I2C bus
I/O冗余:I/O redundancy
ICP分析:ICP analysis
IMOLD:IMOLD
ISM规则:ISM Code
IF钢生产:IF steel producing
ISM分析:ISM Analysis
ICPMS:ICP-MS
ITO废靶:ITO waste target
ISOCS:ISOCS
itron:Itron
ITTFA:ITTFA
I/O接口:I/O interface
ICP刻蚀:ICP
II型裂纹:mode II crack
ICP算法:ICP algorithm
IDL技术:IDL technology
ITO玻璃:ITO glass
ICP技术:ICP
Ir配合物:Iridium complex
In(Ⅲ):In(Ⅲ)
In添加量:In content
Ic变化法:Ic change method
ISO亮度:ISO Brightness
I/O端口:I/O port
IGBTs:IGBTs
IC6合金:alloy IC6
I/O盖片:I/O shield cover
IPM模块:IPM module
IGF-Ⅰ:IGF-Ⅰ
IGF-Ⅱ:IGF-Ⅱ
INIOM:INIOM
ITmk3:ITmk3
ITO靶材:ITO target
IPN涂料:IPN paint
I-EDI:I-EDI
IR光谱法:IR spectrum method
ISO转鼓:ISO drum
ISO代码:ISO Code
ICA技术:ICA technology
IVE模型:IVE model
In-Sn:In-Sn
I/O模板:I/O formwork
IPN技术:IPN technology
IDEF0:IDEF0
IDD估计:IDD estimate
InCl3:InCl_3
ISM方法:ISM method
ICGH5:ICGH5
I2C总线:I2C bus
I/O冗余:I/O redundancy
ICP分析:ICP analysis
IMOLD:IMOLD
ISM规则:ISM Code
IF钢生产:IF steel producing
ISM分析:ISM Analysis
ICPMS:ICP-MS
ITO废靶:ITO waste target
ISOCS:ISOCS
itron:Itron
ITTFA:ITTFA
I/O接口:I/O interface
ICP刻蚀:ICP
II型裂纹:mode II crack
ICP算法:ICP algorithm
IDL技术:IDL technology
ITO玻璃:ITO glass
ICP技术:ICP
Ir配合物:Iridium complex
In(Ⅲ):In(Ⅲ)
In添加量:In content
Ic变化法:Ic change method
ISO亮度:ISO Brightness
I/O端口:I/O port
IGBTs:IGBTs
IC6合金:alloy IC6
I/O盖片:I/O shield cover
IPM模块:IPM module
IGF-Ⅰ:IGF-Ⅰ
IGF-Ⅱ:IGF-Ⅱ
INIOM:INIOM