1) etch and deposition ratio
刻蚀/钝化比
1.
The large effects of the process parameters such as etch and deposition ratio,time of adding passivation gas in etch phase and overrun time of etch and deposition on etching of deep silicon trenches were studied through Bosch technology.
采用Bosch技术研究了在Si深槽刻蚀中刻蚀/钝化比、刻蚀阶段钝化气体保护时间、刻蚀和钝化工艺重叠时间等工艺参数对刻蚀结果的影响。
2) Low corrison
缓蚀钝化
3) etched ratio
刻蚀比
4) etch and deposition overrun time
刻蚀和钝化工艺重叠时间
1.
With proper etch and deposition overrun time,the roughness of sidewalls could be reduced greatly,and the CD loss was decreased by a certain extent.
采用Bosch技术研究了在Si深槽刻蚀中刻蚀/钝化比、刻蚀阶段钝化气体保护时间、刻蚀和钝化工艺重叠时间等工艺参数对刻蚀结果的影响。
5) Corrosion and passivation
腐蚀与钝化
6) passivation etching
钝化层腐蚀
补充资料：钝化膜型缓蚀剂
分子式：
分子量：
CAS号：
性质：见水处理缓蚀剂。
分子量：
CAS号：
性质：见水处理缓蚀剂。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条