2) high-speed interconnects
高速互连
1.
Analysis of coupling and crosstalk of high-speed interconnects on defected ground plane;
不完整地参考面对高速互连耦合及串扰的影响分析
2.
The signal integrity(SI)of high-speed interconnects on meshed ground/power reference plane in high-speed multilayer PCB is investigated both by measurement and simulation.
本文主要基于实验研究,并结合三维全波电磁和电路系统仿真在频域和时域对高速多层PCB板中网孔状接地层或电源层上高速互连的信号完整性性能进行了测试和仿真分析,并对网孔状地参考面的周期性结构所呈现的频率带通(带阻)特性进行了理论分析。
3) high-speed interconnect lines
高速互连线
1.
This paper deduces a system model of high-speed interconnect lines with distributed parameters in time domain,sets the transfer function from the exciting voltage to the voltage of the end of the aggressive line and both ends of the victim line correspondingly,and studies the problem of crosstalk noises from the systematic aspect.
针对互连线系统在高速信号激励下产生的串扰问题,导出高速互连线的时域分布参数系统模型,建立从激励电压到攻击线末端和受害线两端电压相应的传递函数,从系统的角度研究串扰噪声问题。
4) high speed design
高速设计
5) high-speed design
高速设计
6) high-speed interconnection network
高速互连网络
1.
This paper analyzes implementation mechanism of technologies, such as TCP/IP, GAMMA, InfiniBand, and SCI, which exist simultaneously in the current high-speed interconnection network.
分析当前高速互连网络中同时存在的TCP/IP,GAMMA,InfiniBand,SCI等技术的实现机制,介绍RapidIO高性能总线技术。
补充资料：高速
高速度；～发展│～公路。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条