This article is devoted to clarifying the mechanism of reactive wetting and summarizing the change of wetting force of Sn-based solder and the morphology of the interfacial structure by changing the type of alloying elements added to the solder,experimental temperature and metal coating on Cu substrate.

The nano CNTs-PANI metal plating compound was prepared on the electroless plating process to the nano CNTs-PANI,by taken a series of contrast experiments with Ni,Cu and Ni-Cu composite,it was revealed that the nano structure metal particle was distributed uniform,and linked stable on the surface of CNTs-PANI by observed with SEM.