1) the flap of an envelope
信封的封盖
3) covering up of works
工程的盖封
4) covered wall
封盖
1.
According to this feature,transient thermal conductivity of cluster and contact heat transfer coefficient of boundary between cluster and kiln wall are deduced,then heat transfer coefficient between material and covered wall is obtained.
根据回转窑内物料颗粒的运动特点,推导了颗粒团在贴壁运动过程中的非稳态导热系数及界面处的接触传热系数,进而得出了物料与封盖窑壁间的换热系数;结合已有研究成果,建立了回转窑的传热数学模型。
6) pressure-tight bonnet
压力密封的阀盖
补充资料：信封
1.装书信的封套。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条