1) splash back
溅射回来
3) sputtering
[英]['spʌtə] [美]['spʌtɚ]
溅射
1.
XPS study of Ni_(49.54)Mn_(29.59)Ga_(20.87) magnetically driven shape memory alloy thin film fabricated by D.C magnetron sputtering technique;
直流磁控溅射Ni_(49.54)Mn_(29.59)Ga_(20.87)磁驱动记忆合金薄膜的XPS研究
2.
Growth and characterization of aluminum nitride films by penning-type discharge plasma sputtering process;
潘宁放电溅射沉积纳米级AlN薄膜的性质
3.
Growth of TiN Film by Modified Ion Beam Enhanced Magnetron Sputtering;
气离溅射离子镀制氮化钛
4) Sputtered
[英]['spʌtə] [美]['spʌtɚ]
溅射
1.
In order to improve appearance and hydrophobicity of waterproof and moisture permeable coatings, the yellowish of sputtered polymeric fluorocarbon films was investigated.
为改善射频溅射法制备的防水透湿涂层的外观和拒水性 ,对涤纶织物基底上的溅射氟碳高分子膜的泛黄问题进行了研究。
2.
By means of the Monte-Carlo simulation based on the binding collision approximation,this paper investigates the sputtering of Silver and Cadmium element targets bombarded by 27 keV Ar+ ions and studies the spatial distribution of sputtered atoms by collision cascade.
用蒙特卡罗方法模拟能量为２７ｋｅＶＡｒ＋轰击Ａｇ和Ｃｄ单元素靶的力学运动，以研究级联碰撞产生的溅射原子的空间分布情况，对计算结果进行适当的数学处理，以得出微分溅射产额角分布。
3.
The XRD patterns of SnO2 thin film sputtered with different methods are compare 1 for their difference in the field of structure.
本文采用三种不同的溅射方法制备具有纳米尺度的SnO2薄膜,针对溅射方式的不同,结合薄膜结构上的差异,对三种溅射方式制备的SnO2薄膜进行了XRD分析比较。
5) sputter
[英]['spʌtə(r)] [美]['spʌtɚ]
溅射
1.
Cu films sputtered with applied magnet under substrate and their microstructures;
基片下磁场中溅射镀铜薄膜及其微结构
2.
Zinc Oxide Thin Films Prepared Using Microwave ECR Plasma Sputtering Method;
微波电子回旋共振等离子体溅射法沉积ZnO薄膜
3.
Study of TiN Thin Film by Microwave ECR Plasma Reaction Sputtering Deposition;
微波ECR等离子体溅射沉积TiN薄膜的研究
6) spattering
[英]['spætə(r)] [美]['spætɚ]
溅射
1.
However the waterfall model can not simulate the waterfall effect very well and the system lacks proper model to represent the spattering of stream.
对瀑布起点和终点的波特别处理,表现出水的流动效果,同时增加了溅射模型,使系统能够更好地模拟出一般障碍物,以及正面大的障碍物溅水等常见的动画场景。
2.
The preparation of ZnO film using two methods of spattering is also presented.
还介绍了两种溅射方法制备ZnO薄膜。
补充资料：溅射
分子式：
CAS号：
性质：以荷能粒子(常用气体正离子)轰击某种材料的靶面，而使靶材表面的原子或分子从中逸出的现象。利用它可使他种基体材料表面获得金属、合金或电介质薄膜。常见的有阴极溅射(直流溅射)、反应溅射、偏压溅射及射频溅射等，种类颇多。溅射薄膜通常是在惰性气体(如氩)的等离子体中制取。采用溅射工艺具有基体温度低，薄膜质纯，组织均匀密实，牢固性和重现性好等优点。适用于制造薄膜集成电路、片式引线器件和半导体器件等用。
CAS号：
性质：以荷能粒子(常用气体正离子)轰击某种材料的靶面，而使靶材表面的原子或分子从中逸出的现象。利用它可使他种基体材料表面获得金属、合金或电介质薄膜。常见的有阴极溅射(直流溅射)、反应溅射、偏压溅射及射频溅射等，种类颇多。溅射薄膜通常是在惰性气体(如氩)的等离子体中制取。采用溅射工艺具有基体温度低，薄膜质纯，组织均匀密实，牢固性和重现性好等优点。适用于制造薄膜集成电路、片式引线器件和半导体器件等用。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条