1) throwing power
均一电镀能力
2) throwing power
均匀电镀能力
3) throwing power
均镀能力
1.
64 times as that of the conventional technology, and the throwing power is increased 7.
６３８倍，均镀能力提高７。
2.
And raising the concentration of cuprous cya- nide as the main salt is helpful to increasing the current efficiency and throwing power and reducing the electroplating cost as well.
5g/L可以将碳酸钠浓度控制在工艺范围内;降低镀槽电压和增加阳极面积有利于降低碳酸钠的浓度;较高的主盐浓度可以提高镀液的电流效率和均镀能力,有利于降低电镀成本。
4) ability to homogenize
均一化能力
5) plate-throwing power
电镀分散能力
6) levelling power
均镀力
补充资料：均一
1.见"均壹"。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条