1) tinless bronze
无锡青铅<冶>
2) lead bronze
铅青铅<冶>
3) Tin-lead bronze
锡铅青铜
4) tin bronze
锡青铜<冶>
5) lead-free tin electroplating
无铅镀锡
1.
The research status of Sn-Cu alloy electroplating ——new technology of lead-free tin electroplating in Japan was introduced including anode immersion test, SEM research of Sn-Cu alloy deposit, tests of solderability and wettability, moulding process, bending process, hardness, whisker growth acceleration and section EPMA analysis,etc.
介绍了日本无铅镀锡新技术———Sn-Cu合金电镀的研究状况:Sn-Cu合金镀液的阳极浸渍试验,Sn-Cu合金镀层的SEM研究、焊接润湿性实验、成型加工和弯曲加工实验、硬度、晶须发生促进实验、断面EPMA分析等。
6) unleaded pure tin
无铅纯锡
1.
Development of high speed electroplating additives of unleaded pure tin for pin solderability deposits;
引脚可焊性镀层无铅纯锡高速电镀添加剂的开发
补充资料:(无锡)张聿青医案
(无锡)张聿青医案
参见《张聿青医案》条。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条