Ceramic substrates is a thermally conductive material that has a high thermal conductivity,they mainly used as electronic insulator pads and thermal interface material between power semicondutors,heatsinks.

Lining a layer of ceramic pads at the bottom of hearth can directly influence the slag-pig solidified layer.

Application on ceramic backing and flux-cored wire in welding thick-wall clad plate;

Study on ductile fracture behavior of welded joint of one side welding with ceramic backing;

Study on the one-side CO_2 gas shielding arc welding technology for ceramic backing;

Preparation and property test of a new type reticular ceramic packings;

Study and Development of the Three-way Catalytic Converter and Mat Evaluation Test Systems;