1) electricians' solder
电工焊锡
2) electrolysis of solder
焊锡电解
1.
Passivation caused by SbSn in electrolysis of solder containing antimony is studied Compound,SbSn,covers the surface of anodes,and its potential is higher than both lead and tin, respectively The layer of this compound protects the lead and tin from dissolving in electrolyte, and is not able to dissolve itself, that is the reason for anode passivatio
高锑引起焊锡电解中阳极钝化是一个难题 ,引起钝化的主要原因是合金表面存在较多SbSn化合物 ,由于该化合物标准电极电位较铅、锡的标准电极电位正 ,故不发生电化溶解而以网状致密的结构留在阳极表面的阳极泥中 ,导致阳极钝
3) electric soldering wire
电焊锡丝
4) solder engineering capability
焊锡工程能力
1.
Chip solder engineering capability is the most important link in solder system.
实验结果表明,芯片焊锡镀层厚度和焊锡电镀电流强度对芯片后期电特性起着关键作用,芯片镀层厚度是焊锡工程能力最为重要的参数。
5) tin bronze electrode
锡青铜电焊条
6) welder
[英]['weldə(r)] [美]['wɛldɚ]
焊工;电焊机
补充资料：欧洲电工标准化委员会标准(见欧洲电工标准化委员会)
欧洲电工标准化委员会标准(见欧洲电工标准化委员会)
standards of ENELEC: see European Committee for Electrotechnical Standardization; CENELEC
OuZhouD泊ngong Bioozhunhua We咧anhui bicozhun欧洲电工标准化委员会标准s切田di川山ofCENELEC)见欧洲电工标准化委员会。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条