1) afferent surface
传入表面
2) surface implanted
表面注入
1.
Analytical model for the surface electrical field distribution of double RESURF device with surface implanted P-top region;
表面注入P-top区double RESURF功率器件表面电场模型
2.
A novel bulk-silicon surface implanted device with a p buried layer is proposed,and an analytical model for the surface electrical field distributions and breakdown voltage is developed.
提出一种带p埋层的表面注入硅基LDMOS高压器件新结构,称为BSI LDMOS(surface implanted LDMOS with pburied layer)。
3) surface inlet
表面入口
4) heat transfer surface
传热表面
1.
The wavy-fin heat transfer surface is one of the compact high efficiency heat transfer surface, in common use in the application engineering.
波纹型传热表面是工程中常用的高效紧凑型传热表面之一,其热力性能与结构形式及几何参数有直接的关系。
6) surface-conduction
表面传导
1.
In previous study,the surface-conduction field emission(SCFE) structure has been proposed.
在过去的研究中,我们提出了表面传导场发射结构(SCFE),它具有发射效果均匀、稳定,开启电压低,成本低等优点。
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