1) gear burnishing
齿面抛光法
2) double-sided polishing
双面抛光
1.
Based on the analysis of the process of double-sided polishing,we establish a mathematical model when the double-sided polishing machine working in a calm movement state,simulate the process of double-sided polishing by programming language as changing the parameters.
分析了双面抛光机的加工过程,建立了抛光晶片在双面抛光机平稳运动状态下运动的数学模型,采用计算机对双面抛光加工进行运动仿真,并通过改变不同的参数值,得出抛光过程中不同参数对抛光效果的影响。
2.
The wafer motion and the load in double-sided polishing process are main factors which affect the wafer surface quality.
晶片在双面抛光加工过程中具有多向运动、受力复杂、表面材料微细去除的特征,晶片的运动和受力是影响双面抛光加工质量的主要因素。
3.
According to the characteristics of core,clad and solid rim glass material of microchannel plate(MCP),the mechanism of double-sided polishing of MCP was analyzed.
基于微通道板皮料、芯料、实体边玻璃材料的特点,分析了微通道板的双面抛光机理,研究了抛光工艺参数(抛光粉、抛光压力、抛光液pH值等)对MCP平面粗糙度、表面质量的影响,提出了微通道板的抛光工艺及参数:抛光粉应选择莫氏硬度为6、粒度为1。
3) double sided polishing
双面抛光
1.
Based on the kinematic analysis of the planet-double sided polishing process, the equation of relative velocity(the workpiece to the polishing plate) is established.
文中通过行星轮式双面抛光的运动分析,得到工件相对于抛光盘的速度表达式;在Preston方程基础上,建立了材料去除函数和抛光均匀性函数;进行计算机仿真,讨论了不同转速比对抛光均匀性的影响;并通过加工实验验证了仿真与实验结果的一致性,为抛光加工工艺参数的确定提供理论依据。
2.
The precise double sided polishing process is one of the main methods of getting the ultra-smooth surface for these materials.
光电子信息产业的快速发展,要求蓝宝石、单晶硅等材料高效率、超光滑表面加工,精密双面抛光加工是得到这些材料超光滑表面的主要加工方法之一。
3.
In this paper, the new way of double sided polishing processing technic of silicon wafer was designed, and polished process on the new double sided polishing machine.
双面抛光已成为硅晶片的主要后续加工方法,但由于需要严格的加工条件,很难获得理想的超光滑表面。
4) Mirror finishing
镜面抛光
1.
Dimensional control in the process of electrolytic abrasive mirror finishing;
电解镜面抛光中的尺寸控制
5) Cross section polishing
截面抛光
6) double-side polishing
双面抛光
1.
Thus,the application range is widened,the work efficiency is raised by double-side lapping and double-side polishing,and the labour intensity is reduced.
为了提高环形精磨、抛光机的应用效率，文章探讨了对环形精磨、抛光机进行改造，扩大其应用范围，达到双面精磨，双面抛光，可提工作效率，减轻劳动强度。
补充资料：抛光剂,抛光混合剂
CAS：68909-13-7
中文名称：焙烧提浓的氟碳铈镧矿；抛光剂,抛光混合剂
英文名称：Bastnaesite, calcined concentrate；Calcined bastnasite；bastnaesite, calcined conc.；polishing compound；Bastnaesite,calcined concentrate
中文名称：焙烧提浓的氟碳铈镧矿；抛光剂,抛光混合剂
英文名称：Bastnaesite, calcined concentrate；Calcined bastnasite；bastnaesite, calcined conc.；polishing compound；Bastnaesite,calcined concentrate
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条