1) transparent polyamide resin
透明聚酰胺树脂
2) polyamide resin
聚酰胺树脂
1.
Epoxy-bakelite-polyamide resin varnish;
环氧-酚醛-聚酰胺树脂掺混清漆
2.
Study on interface modifying of bamboo fiber reinforced polyamide resin composite;
竹纤维增强聚酰胺树脂复合材料界面改性
3.
The adsorption and desorption capability of five different macroporous resins LSA-20,LSA-21,LSA-30,D-101,AB-8 and polyamide resin in static state were studied by UV-Vis.
比较了五种大孔吸附树脂和聚酰胺树脂对阿尔泰狗哇花总皂苷的吸附与脱附性能。
3) polyamide resins
聚酰胺树脂
1.
This paper introduces a alcohol-soluble polyamide resins was prepared by co-polycondesation with dimer acid and diamine as primary raw.
介绍了一种由二聚酸和二元胺为主要原料制备而成的醇溶性聚酰胺树脂。
2.
This paper introduces the requirements of polyamide resins derived by dimer acids and diamines as primary raw,ap-plied printing ink and the situation at home and abroad and the trend of development.
介绍了由二聚酸与二元胺为主要原料生产的聚酰胺树脂用于油墨的条件、国内外情况及发展趋势。
3.
The technics of adsorption and elution of nuciferine with polyamide resins as adsorbent was studied.
探讨了聚酰胺树脂对荷叶碱的吸附和洗脱工艺。
4) polyamide
[英][pɔli'æmaid] [美][,pɑli'æm,aɪd]
聚酰胺树脂
1.
Study on the morphology and crystallization behavior of column chromatography polyamide
层析聚酰胺树脂的微观形态和结晶性能研究
2.
The thermodynamics and dynamics for adsorption of picric acid onto polyamide under static conditions were studied and the influence of temperature on the adsorption was also inspected.
在静态下,考察了温度对聚酰胺树脂吸附水溶液中苦味酸的影响,探讨了吸附的热力学、动力学规律。
3.
Then, the catechin is dissolved by 40% sulfuric acid solution (mass fraction) after being washed by water, and through the polyamide column.
用ZnCl2 作沉淀剂 ,当溶液pH值为 5 6～ 6 5时 ,将茶叶浸提液中的儿茶素以金属盐的形式沉淀 ,沉淀物经洗涤后 ,用质量分数为 4 0 %的硫酸溶解 ,然后将溶液直接加入聚酰胺树脂柱上 ,先用蒸馏水将Zn2 + ,Na+ 等无机离子除去 ,再用乙醇将茶多酚洗脱 ,洗脱液经浓缩、干燥 ,得到纯度高于 99%的高纯酯型儿茶素 ,提取率达 10 。
5) transparent casting polyurethane resin
透明聚氨酯树脂
1.
Study of transparent casting polyurethane resin synthesis and its performance;
透明聚氨酯树脂材料的合成及性能研究
2.
A series of transparent casting polyurethane resins (TCPU) were synthesized from cycloaliphatic diisocyanate (H_(12)MDI), polyols, crosslinking agent, catalyst, and special aids (T).
以4,4′-二环己基甲烷二异氰酸酯(H12MDI)、聚醚多元醇、交联扩链剂、催化剂及助剂合成了一些透明聚氨酯树脂材料。
6) Polyimide
[英][,pɔli'imaid] [美][,pɑli'ɪm,aɪd]
聚酰亚胺树脂
1.
The curing kinetics of phenylethynyl terminated polyimide;
苯乙炔基封端聚酰亚胺树脂的固化动力学研究
补充资料：透明聚酰胺树脂
分子式：
CAS号：
性质：又称非晶性聚酰胺，聚对苯二甲酰三甲基己二胺。一类几乎不结晶或结晶速度非常低的聚酰胺树脂。除具有与结晶性聚酰胺相似的耐化学性、耐磨性外，透光率80％～85％，成型收缩率低(0.3％～0.8％)、吸湿性小、尺寸稳定性优良等特点。相对密度1.12～1.17。Tg120～160℃。强度、刚性与聚碳酸酯和聚砜相近。拉伸强度53～84MPa。冲击强度(缺口)5～15kJ/m。体积电阻率1011~15Ω·cm。介电常数(103Hz)3～4.3。组成不同、性能差异较大。由特殊二胺和二元羧酸经系列反应后熔融缩聚或溶液聚合制得。加工方法和用途与尼龙6、66相似，但因价格较高，故主要用于需透明的或附加值较高的场合，如与燃油相关的机器零部件，电器电子部件等。
CAS号：
性质：又称非晶性聚酰胺，聚对苯二甲酰三甲基己二胺。一类几乎不结晶或结晶速度非常低的聚酰胺树脂。除具有与结晶性聚酰胺相似的耐化学性、耐磨性外，透光率80％～85％，成型收缩率低(0.3％～0.8％)、吸湿性小、尺寸稳定性优良等特点。相对密度1.12～1.17。Tg120～160℃。强度、刚性与聚碳酸酯和聚砜相近。拉伸强度53～84MPa。冲击强度(缺口)5～15kJ/m。体积电阻率1011~15Ω·cm。介电常数(103Hz)3～4.3。组成不同、性能差异较大。由特殊二胺和二元羧酸经系列反应后熔融缩聚或溶液聚合制得。加工方法和用途与尼龙6、66相似，但因价格较高，故主要用于需透明的或附加值较高的场合，如与燃油相关的机器零部件，电器电子部件等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条