2) sodium hypophosphite
次亚磷酸钠
1.
Poly(maleic anhydride/sodium hypophosphite)——PMAH/SHP used as a non-formaldehyde wrinkle-resistant finishing agent for cotton fabric was synthesized with maleic anhydride and sodium hypophosphite in aqueous polymerization.
以马来酸酐、次亚磷酸钠为原料,采用水相聚合方法,制备了棉织物无甲醛抗皱整理剂——聚马来酸酐/次亚磷酸钠(PMAH/SHP)。
2.
Thus a new bath mainly composed of nickel sulfate, nickel chloride, sodium hypophosphite, boric acid, and sodium fluoride.
对几种电镀镍磷合金镀液进行比较,通过中性盐雾试验,全浸泡腐蚀试验,镀层孔隙率、结合力和硬度测试,得到溶液的主要成分为硫酸镍、氯化镍、次亚磷酸钠、硼酸、氟化钠,并研究了次亚磷酸钠的含量和阴极电流密度对镀层硬度和耐蚀性的影响。
3.
The mechanism of electroless nickel deposition in sodium hypophosphite bath is discussed.
探讨了次亚磷酸钠体系化学镀镍沉积机理。
3) hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸盐
1.
Using the method of Algal Growth Potential Test, the effects of phosphine and its oxidation products, such as phosphite and hypophosphite, on the growth of Microcystis aeruginosa, one of the dominant algae during water bloom seasons, were examined.
采用藻类生长潜力试验(AGP)的方法,研究了磷化氢及其氧化产物亚磷酸盐、次亚磷酸盐对水华暴发优势藻类(铜绿微囊藻)的生长的影响,结果表明:磷化氢及其氧化产物对铜绿微囊藻的生长有重要的影响。
2.
Electroless gold plating using sodium hypophosphite as reducing and potassium thiocyanateas chelate is studied in this paper .
研究了以硫氰化物为络合剂，次亚磷酸盐为还原剂的新型无氰化学镀金工艺，探讨了各因素对化学镀金镀速的影响关系，并得出最佳配方及工艺条件，在最佳条件下，镀速可达到２。
4) Hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸根
1.
Mechanistic Study of Oxidation of Hypophosphite on Pt Electrodes by SNIFTIRS;
次亚磷酸根离子在铂电极上氧化的机理研究(英文)
5) hypophosphite
[英][,haipə'fɔsfait] [美][,haɪpə'fɑsfaɪt]
次亚磷酸钠
1.
A Study on the Technology of Electroless Copper Plating with Sodium Hypophosphite as Reductant;
以次亚磷酸钠为还原剂的化学镀铜工艺研究
2.
Acid electroless nickel phosphorus plating on PZT ceramic was studied with hypophosphite as a reducing agent.
以次亚磷酸钠为还原剂 ,在压电陶瓷表面进行酸性化学镀镍磷。
3.
In this study, Sodium Hypophosphite as a reducing agent instead of formaldehyde, nantokite as activating solution of the activation process to replace the traditional activation process of the precious metal palladium, the Cu2 + and Ni2 + as a catalyst for electroless copper plating timber.
本研究以次亚磷酸钠代替甲醛为还原剂,以常温铜盐为活化液的活化工艺代替传统的贵金属钯盐活化工艺,以复配的具有催化活性作用的Cu2+和Ni2+作催化剂,进行木材化学镀铜。
6) Ammonium Hypophosphite
次亚磷酸铵
补充资料：次亚磷酸
分子式：H3O2P
分子量：65.99626
CAS号：6303-21-5
性质：暂无
制备方法：暂无
用途：暂无
分子量：65.99626
CAS号：6303-21-5
性质：暂无
制备方法：暂无
用途：暂无
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条