1) base pressured filling
底压充填
2) underfill
[英]['ʌndəfil] [美]['ʌndɚ,fɪl]
底部填充
1.
Managing Transient Thermal Environments During the Underfill Process
底部填充工艺的瞬时温度环境管理(英文)
2.
It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill,so it is very important for electronic packaging.
有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
3.
The key tech-nologies of Flip chip technology are that redistribution technology, under bump metallurgy(UBM), bump technology, reflow technology and underfill technology.
倒装技术是发展的关键技术,它包括再分布技术、凸点底层金属(UBM)技术、凸点制备技术、倒扣焊接技术和底部填充技术等。
3) texture filling
底纹填充
1.
The methods and skills of the CorelDRAW X4 texture filling tool for drawing cabochon or bead gemstones,wire and sandblasted effect of metal texture are introduced in detail.
通过实例详细介绍了利用其底纹填充工具绘制各类弧面型或珠形宝石以及具有拉丝、喷砂效果的金属肌理的方法与技巧,初步总结了其底纹库中适于表现宝石外观的底纹样式及其相应的颜色参数。
4) underfiller
底部填充胶
1.
The experiment results show that using a small amount of nano-particles SiO2,Al2O3 and ZnO can apparently improve the moisture absorption property of underfiller,and particularly,the lowest percentage of moisture absorption can be obtained by filling 3%(by mass) ZnO nano-particles.
以纳米SiO2,TiO2,Al2O3,ZnO做为填料制备环氧树脂基的底部填充胶,研究了纳米填料对底部填充胶的吸水性、耐热性以及剪切强度的影响。
6) high pressure pack
高压充填
1.
Application of high pressure pack sand control in Sebei gas field;
高压充填防砂工艺在涩北气田的应用
补充资料：阿钵底钵喇底提舍那
【阿钵底钵喇底提舍那】
（术语）A^patti-pratides/ana，忏悔之梵语，新译曰说非。寄归传二曰：“阿钵底者，罪过也。钵喇底提舍那，即对他说也，旧云忏悔。非关说罪。何者？忏摩乃是西音，自当忍义。悔乃东夏之字，追悔为目。悔之与忍回不相干。若的依梵本，诸除罪时，应云至心说罪。”饰宗记八本曰：“旧云忏悔。”
（术语）A^patti-pratides/ana，忏悔之梵语，新译曰说非。寄归传二曰：“阿钵底者，罪过也。钵喇底提舍那，即对他说也，旧云忏悔。非关说罪。何者？忏摩乃是西音，自当忍义。悔乃东夏之字，追悔为目。悔之与忍回不相干。若的依梵本，诸除罪时，应云至心说罪。”饰宗记八本曰：“旧云忏悔。”
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条