1) metal pits defect
金属点缺陷
1.
In semiconductor manufacture, metal pits defect always exists in Al film, which badly degrades HD (High Definition) LCOS (Liquid Crystal On Silicon) surface flatness and reflectivity, impacts backend assembly testing yield, and induces reliability issue.
金属点缺陷普遍存在于半导体制造业所采用的金属铝薄膜中。
2) metal defect
金属缺陷
1.
Microcomputer application in the analyzing of metal rupture and metal defect—The research of MFAS V1.0 and MFAS V1.0 software;
微机在金属断口与金属缺陷分析中的应用——MFAS V1.0和MDAS V1.0软件的研制
3) the lacunas of metallic object
金属体缺陷
1.
Base on experiments,the lacunas of metallic object can be effectively and exactly judged by this system.
通过对TIG焊快速制造原理及金属体缺陷的分析,根据含有缺陷的焊缝图像的特点,提出一种与传统焊接传感系统传感对象不同的金属体缺陷定位传感系统,并详细介绍了系统组成、工作流程及缺陷判决算法。
4) inclusions(metallic defects)
夹杂(金属缺陷)
6) metal deficit type
金属缺陷模型
1.
It was found that initial discharge capacity of the electroactive compounds was about 140 mAh/g and after 15 cycles the capacity was about 130 mAh/g and the metal deficit type and the conductive mechanism was proposed.
8mAh/g ,循环 15次后仍有 13 0mAh/g以上 ;并且提出了金属缺陷模型和该模型的导电机理———电子空穴导电机理。
补充资料：点缺陷(见晶体缺陷)
点缺陷(见晶体缺陷)
point defect
点缺陷point defeet见晶体缺陷。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条