1) area array packaging
面阵封装
1.
The manufacture of solder bump is one of the key technologies for area array packaging (AAP) such as ball grid array (BGA), chip scale packaging (CSP) and flip chip (FC).
钎料凸台的制造是球栅阵列封装(BGA, ball grid array)、芯片尺寸级封装(CSP, chip scale packaging)及倒装芯片封装(FC, flip chip)等面阵封装的关键技术之一。
2.
The manufacture of solder bump is one of the key technologies for area array packaging (AAP).
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。
2) Area array packages
面阵列封装器件
1.
Area array packages are widely used in all kinds of electrict products.
面阵列封装器件在电子产品中的使用率逐年上升,如何实现其高速贴装是影响生产线效率的重要因素,从不同的角度论述了面阵列封装器件实现高速贴装的手段与技术。
4) Planar array chip packaging interconnecting
面阵列芯片封装互连
6) BGA
球栅阵列封装
1.
Comparison between Ultra-fine Pitch QFPs and BGAs and their Future;
超细间距方形扁平封装与球栅阵列封装的比较及其发展趋势
2.
Per customer\'s requirement,the company need to build up the Pb-free packaging capability for the BGA product.
为此,本公司需要建立球栅阵列封装类型产品的无铅封装能力。
3.
Ball grid array(BGA)packaging is widely used in surface mount assembly for its good performance.
球栅阵列封装(BGA)综合性能好,广泛应用于表面贴装。
补充资料：波阵面
简称“波面”。波源发出的振动在介质中传播经相同时间所到达的各点组成的面。同一波阵面上各点的振动位相相同。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条