1.
TQFP (Thin Plastic Quad Flat Pack
薄型方面平面封装)
2.
the lurid covers of paperbacks
颜色刺眼的平装书封面
3.
Power/Ground Planes Analysis and Optimization in Package and PCB;
封装和PCB上电源/地平面的分析和优化
4.
Specification of lead frames for plastic quad flat package
GB/T15876-1995塑料四面引线扁平封装引线框架规范
5.
Research and Development of Planar Waveguide Circuit's Packaging Software
平面波导器件封装工艺软件的研究与开发
6.
the seal of the air-balancing cylinder adopts multi-stage seal;
气平衡缸密封部位采用多级密封装置 ;
7.
Development and Application of Mechanical Seal Device of Ground Injection Equipment with Horizontal Submarine Pump
水平电泵地面注水设备中机械密封装置的研制与应用
8.
Study on High-Acceleration/High-Precision Aerostatic Positioning Stage for IC Packing;
面向芯片封装的高加速度高精度气浮定位平台的研究
9.
Motion Control System Design of a High Speed Precision Positioning Platform for IC Package;
面向芯片封装的高速精密定位平台控制系统设计
10.
Wrappering: Attaching a paper or board cover by gluing at the spine of a book block which may be stabbed, adhesive bound or sewn.
包封面:在书芯(用铁丝平订,胶装或线装造成)的脊部加胶,贴上纸或纸板书皮的情况。
11.
Area Array Package--BGA/CSP & flip chip
BGA/CSP和倒装焊芯片面积阵列封装技术
12.
Technique issues such as clamping deformation, guarantee of hole position accuracy and plane seal, etc. for motorcycle case body and case cover are introduced.
介绍了摩托车箱体、盖加工中的装夹变形、位置精度和平面密封保证等方面的工艺问题。
13.
Having a cover of thick paper boards covered with cloth.Used of a book.
布面精装的做封面的原纸面上盖有布面的，用于书的封面
14.
Recent Progress of ACF in Flat Panel Display Packaging Applications
应用于平板显示器封装的ACF新进展
15.
a cardboard used by bookbinders to make covers for books.
装订工用来做书的封面的纸板。
16.
Dispensing System Design and Emulation for RFID Packaging;
面向RFID封装的点胶系统设计与仿真
17.
The Detail Design of the Modern Book Cover Design
现代书籍装帧封面设计中的细节设计
18.
To ornament(a book cover) with a bookbinder's tool.
压印用装订商的压印器装饰（一本书的封面）