1) Fillet lifting
焊盘剥离
2) bonding lift
焊点剥离
1.
From electrical test results before and after IR reflow of two different group samples,coupled with devices failure analysis,it s found the oxidation of lead frame is an important factor for the mechanism of bonding lift,and the thermal mechanical effect in solder reflow can accelerate the occurrence of this potential failure.
比较回流焊前后两组器件样品的电学测量结果,并结合样品的失效分析,发现引线框架氧化也是导致焊点剥离失效的一个重要因素,而且回流焊工艺下的热机械效应,会加速原先潜在的焊点剥离失效的发生。
3) Placenta separation
胎盘剥离
5) pad pitch
焊盘距离
6) separation of placenta
胎盘剥离;胎盘早期分离
补充资料：重利盘剥
1.谓用高利贷的方式进行剥削。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条