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1)  drop shock experiment
跌落冲击试验
1.
In order to obtain the experiential formulas and characteristic factors of dynamic cushion curves and provide basic data for utilizing X-PLY corrugated paperboard in transportation packaging,dynamic cushioning properties of X-PLY(A) and X-PLY(B) corrugated paperboard were investigated by drop shock experiments.
基于跌落冲击试验,研究X-PLY(A)、X-PLY(B)两种超强瓦楞纸板的动态缓冲性能,获得了动态缓冲特性曲线的经验公式及其特征系数,为X-PLY超强瓦楞纸板在缓冲包装中的推广应用提供了基本数据。
2)  Drop impact test
冲击跌落试验
3)  drop testing machine
跌落式冲击试验机
1.
By applying the drop testing machine to automatically simulate half-sine pulse,the calculating model was set up to describe the course of half-sine pulse generated by the rubber waveform generator,based on the basic mechanical principle of half-sine pulse generation and non-linear of the rubber waveform generation in the condition of quasi-static compress.
采用跌落式冲击试验机机械模拟半正弦冲击波,以半正弦冲击波形产生的基本力学原理以及橡胶波形发生器在准静态压缩情况下的材料非线性为基础,建立描述橡胶波形发生器生成半正弦冲击波过程的理论计算模型。
4)  Vertical impact test method by dropping
垂直冲击跌落试验
5)  drop impact
跌落冲击
1.
A 3-D FE model was established in order to investigate dynamic responses of the round PCB and find the weakness of solder joint in packaging under drop impact.
针对JEDEC标准板的局限性,设计一种圆形PCB,建立其三维有限元模型,运用ABAQUS有限元分析软件对设计板在跌落冲击载荷下的动态特性进行模拟仿真,找到封装中焊点的薄弱环节,得出焊点的应力状况与PCB板的挠曲变形存在一致的对应关系,验证PCB板在跌落冲击过程中弯曲振动导致的交变应力是焊点破坏的原因。
2.
With increase in electronic package density,the reliability of a board-level package under drop impact load becomes a key issue.
随着微电子封装密度的提高,板级封装在跌落冲击载荷下的可靠性成为人们关注的焦点。
3.
Drop direction is an important parameter of drop impact,this paper presented a new method to measure drop direction and introduced the basic structure,measurement circuit and principle of the sensor.
跌落方位是跌落冲击中的一个重要参数,测量较为困难,提出了一种基于电容传感器的跌落方位现场测试新方案,分析了其基本结构、测量电路、测试原理和方法。
6)  drop/impact
跌落/冲击
补充资料:Izod冲击试验
分子式:
CAS号:

性质:又称悬臂梁式冲击试验。一种常用的抗冲击性测试方法。用一自由落下的摆锤去撞击一垂直放置的矩形截面的直条棒状试样。试样的下端固定。试样可以是带刻痕或不带刻痕的。Izod冲击强度反映试样遭撞击破坏时摆锤的能量损失。可用单位试样宽度的能量或单位试样截面的能量表示。需要注意Izod冲击强度是随试样的尺寸而异的。

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