1) electronic assembly industry
电子封装行业
1.
Based on the occupational hazards classification lists and occupational disease causation models issued by China,the occupational hazards existing in the electronic assembly industry are analyzed and identified according to the features of materials,equipment and staffs in DIP and QFP/SOIC production process.
从电子封装行业工艺入手,依据国家颁布的职业有害因素分类目录及职业有害因素致病模型,针对电子封装行业插入式(DIP)及表面贴装(QFP/SOIC)制造工艺使用的材料、设备、条件、人员作业特点,对行业内具有共性的职业有害因素进行分析,对工艺过程中存在的职业有害因素作出辨识,并提出把硅粉尘、铅、氩气、高温、环氧树脂、氢氧化钾、噪声、酸雾、重复性静态作业、重复性动态作业等有害因素作为防控重点,为电子封装行业职业有害因素的危害量化评价及其防控措施制定提供了科学依据。
2) electronic packaging
电子封装
1.
Preparation of high volume fraction SiCp/Al composites for electronic packaging;
电子封装用高体积分数SiCp／Al复合材料的制备
2.
Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications;
环保型电子封装用Sip/Al复合材料性能研究
3.
Preparation of SiC particulate reinforced 356Al matrix composite for electronic packaging and its thermal expansion performance;
电子封装SiCp/356Al复合材料制备及热膨胀性能
4) electronic package
电子封装
1.
Based on ourselves' research activity and literature reports,evaluated and discussed the development trend of composite electronic package and substrate materials.
本文论述了陶瓷颗粒(纤维)增强聚合物基复合电子封装与基板材料体系和性能特点,介绍了复合基板材料的实验研究和理论研究进展情况,根据实验研究和文献报道并结合目前在微电子封装领域广泛应用的环氧塑封材料,对复合电子封装与基板材料的发展趋势进行了分析和评述。
2.
Development of advanced electronic package devices promoted the study on the reflow soldering.
先进电子封装器件的出现推动了再流焊方法和设备的研究。
3.
Solder joints functioned as mechanical, thermal and electrical interconnections between electronic packages and the printed circuit board (PCB), their failure can lead to critical malfunction of electronic products directly.
焊锡接点是电路板和电子封装之间传递电信号的媒介,同时还起到机械连接和支撑的作用,其破坏将直接导致电子产品失效。
5) electronics packaging
电子封装
1.
Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.
介绍了电子封装材料中用于引线键合工艺的几种主要导电丝材料 ,包括金丝、铜丝和铝丝。
2.
System In Packaging SIP is a brand-new technology of electronics packaging.
系统封装(System In Packaging)是电子封装工艺的前沿技术。
6) Optoelectronic packaging
光电子封装
1.
Fiber fixing process is critical tooptoelectronic packaging.
激光器件组件封装中发光设备与光纤之间的耦合要达到微米级甚至亚微米级精度,光纤的固定技术成为光电子封装中的关键。
补充资料：电子-电子双共振
在垂直静磁场H的方向,施加两个微波电磁场:①较弱的微波电磁场，激发电子从能级2向能级3跃迁，不致于饱和；②强的微波电磁场，激发电子从能级1向能级4跃迁，使达到饱和，从而导致能级4的电子转移至能级3，以观察反映2→3跃迁的电子自旋共振信号强度的变化，故称为电子－电子双共振。它与电子-核双共振不同之处是不涉及核的跃迁，并且观察的与电子自旋共振有关的能级和未观察的跃迁能级之间无共享的公共能级。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条