1.
The FEA Simulation of Moisture Diffusion in Electronic Packages;
塑料电子封装件中湿扩散有限元分析
2.
Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究
3.
Fundamental Study of Novel Si-Al Electronic Packaging Materials
新型电子封装Si-Al合金的基础研究
4.
The Application of "5S" Activity in Electronic Packaging Industry
“5S”管理在电子封装企业中的应用
5.
Study on the Reliability of SMT Solder Joint in Electronic Packaging;
电子封装中表面贴装焊点的可靠性研究
6.
Thermal Performance Research on Electronics Packaging Component Based on Flip Bonding;
基于倒装焊接的电子封装器件热性能的研究
7.
Thermal-Mechanical and Hygroscopic Characteristics of Micro-electronic Packaging Polymer and Its Packaging Reliability Study;
微电子封装高聚物热、湿—机械特性及其封装可靠性研究
8.
The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展
9.
Research Progress in Anisotropic Conductive Adhesives for Microelectronic Packaging
微电子封装用各向异性导电胶的研究进展
10.
Interfacial Reaction and Reliability in Lead-free Electronics Packaging;
无铅电子封装中的界面反应及焊点可靠性
11.
Development of Lead Free Solder and Its Interfacial Issues in Electronics Packaging;
电子封装互连无铅钎料及其界面问题研究
12.
Research on Design Method and Properties of Eletronic Packaging Single Crystal Copper Wire;
电子封装单晶铜键合丝制备工艺及性能研究
13.
Fabrication and Properties of SiCp/Al Electronic Packaging Housing by Gas Pressure Infiltration;
气压浸渗SiCp/Al电子封装外壳的制备与性能
14.
The Research on Properties of SiC_p/Al Composite for Electronic Packaging;
电子封装SiC_p/Al 复合材料性能及影响因素研究
15.
Fabrication and Properties of SiC_p/Al Electrical Packaging Composites by Spark Plasma Sintering;
SiC_p/Al电子封装复合材料的SPS烧结及性能研究
16.
Thermophysical Properties of Aluminum Infiltrated Silicon Carbide for Electronic Packaging;
铝渗碳化硅电子封装材料的热物理性能
17.
Dynamic Bending Experiment and Numerical Study of Board Level Electronics Package;
板级电子封装动态弯曲实验及其数值模拟
18.
Study on Electronic Encapsulation Material Basied on Benzoxazine Resin;
苯并噁嗪树脂在电子封装材料中的应用研究