1) wettability and spreadability
润湿铺展性能
1.
Wettability and spreadability of Sn-Ag-Cu lead-free solder on Cu substrate were tested by diode laser soldering system,influence of different soldering parameters on wettability and spreadability of Sn-Ag-Cu lead-free solder was studied.
采用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在Cu基体上进行了润湿铺展性能实验,研究了半导体激光工艺参数对Sn-Ag-Cu无铅钎料润湿铺展性能的影响规律。
2) wetting and spreading
润湿铺展
1.
Using the software Ansys, the non-uniform temperature field under static TIG argon-arc brazing is analyzed for the wetting and spreading of copper-base filler metal.
采用Ansys软件对定点TIG氩弧加热条件下Cu基钎料润湿铺展非等温温度场进行分析和研究,得出不同的燃弧参数(燃弧电流、燃弧时间)和加钎料与否对镀锌板温度场的影响。
2.
The relationships between wetting and spreading and welding current in arc-assisted hot-wire welding of cool-body with wire HS201 on 20 steel sheet were investigated,and the laws between breadth of spreading zone and wetting angle were obtained.
采用热丝冷体TIG堆焊工艺,分析了在20钢板上堆焊HS201焊丝时,熔化焊丝的润湿铺展行为、效果与焊接电流等工艺参数之间的关系,得到了焊接电流与铺展宽度、润湿角之间联系的规律,发现增加焊接电流能有效改善其铺展性。
3) spreading wetting
铺展润湿
4) Wetting and dewetting
铺展与润湿
5) Polymer wetting
铺展和润湿
6) spreadability
铺展性能
1.
Effects of Ce on spreadability of Sn-Cu-Ni lead-free solder and mechanical properties of soldered joints;
稀土元素Ce对Sn-Cu-Ni无铅钎料铺展性能及焊点力学性能的影响
2.
Effects of Ce on physical properties and spreadability of Sn-Cu-Ni solder;
稀土Ce对Sn-Cu-Ni钎料物理性能和铺展性能的影响
3.
Effect of Ag and Ni on melting temperature and spreadability of Sn-SbCu solder alloy
Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响
补充资料：铺展润湿
分子式：
CAS号：
性质：液体和固体表面接触后在表面上展开，原来的固气界面被固液和液气界面取代的过程。若以vSL,vSV,vLV分别表示单位面积固液、固气、液气界面的界面自由能，则液体在固体表面上展开单位面积体系自由能的变化为：△G=vSL+vLV-vSV。常以铺展系数S（也称铺展功work of spreading）表征铺展过程进行的可能性：S=-△G= vSV-vSL -vLV。显然，△G≤0，即S≥0液体可在固体表面自动展开。
CAS号：
性质：液体和固体表面接触后在表面上展开，原来的固气界面被固液和液气界面取代的过程。若以vSL,vSV,vLV分别表示单位面积固液、固气、液气界面的界面自由能，则液体在固体表面上展开单位面积体系自由能的变化为：△G=vSL+vLV-vSV。常以铺展系数S（也称铺展功work of spreading）表征铺展过程进行的可能性：S=-△G= vSV-vSL -vLV。显然，△G≤0，即S≥0液体可在固体表面自动展开。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条