4) deposit adhesion
镀层结合力
1.
Pre-plating processes and their influences on deposit adhesion for aluminum and its alloy;
铝和铝合金电镀前处理工艺及其对镀层结合力的影响
2.
A new electroless silver plating process for diamond was pressented with improvements on deposit adhesion and anti-tarnishing of silver deposit.
经粗化处理 ,可以提高镀层结合力 ,而又不影响镀层光泽。
5) low inner stress nickel electroplating
低应力镀镍
1.
ZF410 plating solution plus additives for low inner stress nickel electroplating process and ZF305 plating solution plus additives for neutral pure tin electroplating process were developed, and successfully used in the tri-layer terminal electrode technology for chip components.
研制出了ZF410低应力镀镍、ZF305中性纯锡电镀液和添加剂,并在片式元件三层端电极上获得成功应用。
6) galvanized layer combining capacity
镀锌层结合力
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条