1)  assembly and welding process
装焊工艺
1.
Mode of generating process for assembly and welding process CAPP system of welding structure;
焊接结构装焊工艺CAPP系统中工艺生成模式
2)  assembling and welding
装焊
3)  assembly welding
组装焊接
4)  barrel packed welding wire
筒装焊丝
5)  flip chip
倒装焊
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
3.
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;
倒装焊微电子封装结构参数的概率设计
6)  Assembly and joint workstation
装焊单元
参考词条
补充资料：装聋装哑
1.见"装聋作哑"。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。