1) Chalalzal region morphology
合点区形态
2) character of chalazal region
种子合点区形态
3) morphology of seed endotesta at chalazal region
种子内种皮合点区形态
4) solder joint shape
焊点形态
1.
Using the mode and simulatrng the solder joint shapes,find the root cause of solder defects identify the relationship of designand process parameters,suggest design improvemet.
结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。
2.
3-D(Three-dimensional) predicting model of QFN solder joint shape is built by Surface Evolver software based on minimal energy principle and finite mathematical analysis method.
采用基于最小能量原理和有限元数值分析方法的Surface Evolver软件,建立了四方扁平无引脚器件(QFN)焊点三维形态预测模型;选取焊盘长度、焊盘宽度、焊料体积、间隙高度作为4个关键因素,采用水平正交表设计了9种不同的QFN焊点工艺参数水平组合,建立了这9种焊点的三维形态预测模型,得到了不同工艺参数水平组合下的QFN焊点形态;焊盘长度、焊盘宽度、焊料体积、间隙高度等工艺参数的改变对QFN焊点的三维形态均有影响。
3.
The 3-D evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论,建立了LCCC器件焊点三维形态预测模型。
5) solder joint shapes
焊点形态
1.
By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes.
通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。
2.
In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design , SMT product assembling process design and assembling quality detecting are demonstrated.
在介绍 SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在 SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法。
6) solder joint geometry
焊点形态
1.
By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.
采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。
2.
Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.
本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 。
补充资料：未设镇建制的工矿区居民点的基本特点
末设镇建制的工矿区居民点是一种特殊的城市实体。它的基本特点是：居住人口以非农业人口为主，但人口规模往往较小；大多数产业结构单一，布局与功能较为简单；由于距大中城市较远，所以具有一定的独立的城市机能，能够行使一定的城市运行功能；社会生活方式和城市相似，但又受到自身某些特殊情况的制约，一般的说，在条件成熟后，按照社会生活民主化与法制化的原则，将会设置城市建制。这类居民点的形成主要是适应国家某些需要远离城市单独选址建设的大中型项目的需要。它对于我国生产力和城镇的合理布局有重要意义。
工矿区居民点的基本特点与城市相似，但又具有不同于一般城市的特性。规定它的规划建设与管理参照执行《城市规划法》，其目的：一是可使其根据各自的具体情况参照《城市规划法》，制定具体的规划管理规定，保证建设科学合理地进行；二是为了在其设置城市建制后必须全面贯彻《城市规划法》时，可以有一个比较好的工作基础。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条