1) form of singular point
奇点形态
2) singular nature
奇点性态
3) abnormal singularity
变态奇点
4) solder joint shape
焊点形态
1.
Using the mode and simulatrng the solder joint shapes,find the root cause of solder defects identify the relationship of designand process parameters,suggest design improvemet.
结合仿真技术模拟焊点形态,可以找出造成焊点缺陷时各参数之间的关系并提出相应的解决方案,从而优化工艺设计及制造工艺控制参数。
2.
3-D(Three-dimensional) predicting model of QFN solder joint shape is built by Surface Evolver software based on minimal energy principle and finite mathematical analysis method.
采用基于最小能量原理和有限元数值分析方法的Surface Evolver软件,建立了四方扁平无引脚器件(QFN)焊点三维形态预测模型;选取焊盘长度、焊盘宽度、焊料体积、间隙高度作为4个关键因素,采用水平正交表设计了9种不同的QFN焊点工艺参数水平组合,建立了这9种焊点的三维形态预测模型,得到了不同工艺参数水平组合下的QFN焊点形态;焊盘长度、焊盘宽度、焊料体积、间隙高度等工艺参数的改变对QFN焊点的三维形态均有影响。
3.
The 3-D evolving model of LCCC solder joint shape is based on the minimal energy principle and the solder joint shape theory.
基于最小能量原理和焊点形态理论,建立了LCCC器件焊点三维形态预测模型。
5) solder joint shapes
焊点形态
1.
By applying the relation between the solder joints shape parameters and thermal fatigue life,and based on the solder joint reliability,the optimization software is used in the optimal evaluating of the solder joint shapes.
通过对 CCGA焊点形态参数与热疲劳寿命进行正交回归分析 ,得出了 CCGA焊点形态主要参数与热疲劳寿命之间的关系表达式。
2.
In this paper, based on presenting the basic concept of solder joint shapes theory and virtual evolving technology of SMT solder joint, the application theory and methods of SMT solder joint virtual evolving technology in the field of SMC/SMD component structure design , SMT product assembling process design and assembling quality detecting are demonstrated.
在介绍 SMT焊点形态理论和焊点虚拟成形技术基本概念的基础上 ,论述了该技术在 SMT元器件结构设计、SMT产品组装工艺设计和组装质量检测等领域中的应用原理及方法。
6) solder joint geometry
焊点形态
1.
By employing the potential energy controlling equation for SnPb solder joint formation in surface mount technology,the 3D solder joint geometry were numerically simulated.
采用表面组装SnPb焊点形态的势能控制方程 ,对片式元件RC32 16的三维焊点形态进行了数值模拟。
2.
Energy controlling equation for solder joint geometry in flip chip technology was presented and three dimensiond duplex solder joints (with high Pb base solder bump and eutectic SnPb solder fillet) geometry was predicted by using surface evolver program.
本文给出了倒装焊 (flip chip)焊点形态的能量控制方程 ,采用SurfaceEvolver软件模拟了倒装焊复合SnPb焊点 (高Pb焊料凸点 ,共晶SnPb焊料焊点 )的三维形态 。
补充资料：Hirzebruch奇点
hirzebruch奇点就是用方程z^d=x^a * y^b定义的曲面奇点。 大数学家hirzebruch第一个系统研究了这种奇点。
这类奇点和连分数有着密切联系。它是代数几何－－特别是代数曲面中的一类重要研究对象。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条