1) packaging stress
封装应力
1.
Piezoresistive strain gauge array for packaging stress test;
测试封装应力用压阻式应变计阵列
3) Non-stress packaging
无应力封装
1.
Substrate strengthen design and O rings suspension package realize well effect non-stress packaging.
衬底强化设计和O型圈悬浮封装的巧妙结合实现了无应力封装。
4) assembly with low stress
低应力封装
5) package effect
封装效应
6) Application Encapsulation
应用封装
补充资料：轧辊残余应力(见轧辊应力)
轧辊残余应力(见轧辊应力)
residual stresses in roll
zhagun eanyu yingli轧辊残余应力(residual stresses in roll)见礼辐应力。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条