1) Super Chemical Assistant
超级化学助手
2) Bottom-up fill
超级化学镀
3) bottom-up filling for electroless copper
超级化学镀铜
1.
The latest researches on bottom-up filling for electroless copper deposition at home and abroad were summarized, including the electroless copper deposition technology applied to copper interconnection of semi- conductor and the formaldehyde-free electroless copper deposition using sodium hypophosphite as reducing agent.
概述了国内外关于超级化学镀铜填充技术的最新研究成果,主要包括应用于半导体铜互连线工艺的化学镀铜和以次磷酸钠作还原剂的无甲醛化学镀铜。
2.
In order to fill these micro-holes completely and to decrease the difficulty in CMP technological process, computer simulation of bottom-up filling for electroless copper deposition has not only great theoretical value, but also has application value.
由于化学铜溶液中添加剂SPS对化学铜的沉积速度有直接影响,故只有完全了解了超级化学铜填充机理以及化学镀溶液中SPS为主要添加剂的化学形态和浓度变化规律,才能实现超级化学镀铜工艺工业化。
5) diener
['di:nə]
医学助手
6) metachemistry
[,metə'kemistri]
原子结构化学，超级化学
补充资料：助手
协助别人办事的人：得力助手｜还需要两个助手。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条