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1)  interfacial delamination
底充胶分层
2)  underfill [英]['ʌndəfil]  [美]['ʌndɚ,fɪl]
底充胶
1.
Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
2.
Influence of hygro-thermal stress on interfacial delamination of FCOB device with underfill;
湿热载荷对含底充胶的FCOB器件界面分层影响
3.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling;
固化残余应力对倒装焊底充胶可靠性的影响
3)  underfiller
底部填充胶
1.
The experiment results show that using a small amount of nano-particles SiO2,Al2O3 and ZnO can apparently improve the moisture absorption property of underfiller,and particularly,the lowest percentage of moisture absorption can be obtained by filling 3%(by mass) ZnO nano-particles.
以纳米SiO2,TiO2,Al2O3,ZnO做为填料制备环氧树脂基的底部填充胶,研究了纳米填料对底部填充胶的吸水性、耐热性以及剪切强度的影响。
4)  mining method of downward slice and consolidated fill
下向分层胶结充填法
5)  descending slicing with consolidated fill
下向分层胶结充填
6)  cemented phosphgypsum backfill
磷石膏分层胶结充填
1.
It is the best way to introduce cemented phosphgypsum backfill technology in Xinqiao Pyrite Mine(XPM), Anhui province, in order to overcome backfill aggregate shortage face to the mine and to treat solid waste of phosphgypsum produced in Liuguo Branch of Tongling Chemical Industry Group Co.
为解决新桥硫铁矿充填骨料来源不足的难题,利用铜陵化工集团公司六国公司固体废料磷石膏进行了磷石膏分层胶结充填关键技术研究,并对该技术的可靠性进行了科学评价。
补充资料:充炭黑充油丁苯橡胶
分子式:
分子量:
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性质:同时含有炭黑和油的丁苯橡胶。性能和用途与充炭黑丁苯橡胶和充油丁苯橡胶相似。由冷聚丁苯胶乳与炭黑的水分散液和油乳液经混合、凝聚、洗涤、过滤、干燥等步骤制得。

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