1.
Influence of Cure-residual Stress on Underfill Epoxy Reliability in Flip-Chip Assembly Under Thermal Cycling
固化残余应力对倒装焊底充胶可靠性的影响
2.
Underfill Delamination of Flip Chip on Low-Cost Board
低成本基板倒装焊底充胶分层裂缝扩展研究
3.
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
4.
One Fast Flow of Low Temperature Curing Adhesive Underfill
一种快速流动可低温固化的底部填充胶
5.
Effects of the Properties by Filling Nano-Particles into Epoxy Resin Based Underfiller
纳米填料对环氧树脂基底部填充胶性能的影响
6.
counterbore with guide
有导柱的平底扩充孔钻
7.
think about at length and in depth.
思考问题充分而又彻底。
8.
styrene-acrylic latex primer for metal
苯丙型金属乳胶底漆
9.
rubber sole auto hydraulic press
橡胶鞋底自动液压机
10.
bottom loading belt
底带装载式胶带输送机
11.
photographic(al) film
胶片(薄膜), 照相底片
12.
filled polyisoprene rubber
填充聚异戊二烯橡胶
13.
calking compound, synthetic rubber base, wooden deck seam application
木甲板合成橡胶填充料
14.
inflatable product of rubber coated fabrics
充气橡胶涂覆织物制品
15.
permeable consolidated gravel pack
可渗透胶结砾石充填体
16.
clog with outer soles and uppers of rubber or plastics
木底鞋,外底和鞋帮由橡胶或塑料制成
17.
A rubber-soled cloth shoe; a sneaker.
橡皮底帆布鞋，帆布胶底运动鞋
18.
Adhesive paper: Paper coated on one side with adhesive gum,
胶底纸:纸的一面涂上粘性胶，