1) multi-step dielectric groove isolation
多台阶介质槽隔离
1.
A new type of device structure,SiCOI MESFET with multi-step dielectric groove isolation,is presented.
用二维器件仿真软件 MEDICI对 Si COI(Si C on insulator) MESFET的击穿特性进行了研究 ,提出了一种新的 Si COI MESFET器件介质槽隔离结构 ,即多台阶介质槽隔离结构 。
2) dielectric groove isolation
介质槽隔离
1.
A new type of SiCOI MESFET device s tructure, SiCOI MESFET with dielectric groove isolation, is presented.
提出了一种新型的 Si COIMESFET器件结构 ,即介质槽隔离 Si COIMESFET。
3) Deep trench isolation
深槽介质隔离
4) Dielectric isolation
介质隔离
1.
This paper applied MEMS processing technology to make sensor component and special dielectric isolation packaging process,developed pressure sensor;and produced several technical innovations on cavity inner filling frame,oil filled location and corrugated diaphragm,which improved product s filter pulse pressure,anti-over loading,and temperature factor.
运用MEMS工艺技术制作的敏感元件和介质隔离特殊封装工艺,研制出压力传感器。
6) material multilevel
介质多阶
1.
Several typical multilevel schemes are presented for two kinds of multilevel optical storage,which are signaling multilevel and material multilevel respectively.
综述了多阶光存储的发展历史及研究现状,并针对多阶光存储的两种类型(信号多阶和介质多阶),列举了几种典型的多阶光存储方案。
补充资料：多介质深层过滤器
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说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条